HONG KONG, Dec 19, 2017 - (ACN Newswire) - ASM Pacific Technology Ltd. (ASMPT), a world leader in the supply of semiconductor assembly and packaging equipment and materials, as well as surface mount technology solutions announced today that it has been awarded the Technological Achievement Grand Award of the Hong Kong Awards for Industries (HKIA) 2017. This is the third time ASMPT has bagged this award, with prior win in 1999 and 2015, respectively.
Established in Hong Kong since 1975, ASMPT has always been in the forefront to develop new technology and spur innovation. These are best exemplified in its long-standing policy to invest up to 10% of its annual equipment revenue in R&D irrespective of short term sales fluctuations, as well as collaboration with various research institutes and customers on joint projects to explore new technologies and ideas.
The Award was granted to ASMPT based on key judging criteria of excellence in technology and intellectual property, impact on the industry, market recognition and its contribution to Hong Kong industry.
This time, ASMPT is recognized for its significant achievement in its innovative Active Alignment Solution that allows CMOS camera module (CCM) for smart phones to be built with the best optical performance for capturing outstanding pictures. Through unrelenting efforts in research and development and years of engagement with leaders of the industry, ASMPT has designed the industry's leading active alignment system that has been used to assemble more than 80% of the high-end mobile phone CCM in the global market. Developed by its R&D team in Hong Kong and manufactured in China, the IS600GS is a fully automatic active alignment platform for high volume manufacturing. Known in the industry as the de facto active alignment platform, IS600GS's value propositions include offering customers the highest productivity with lowest cost of ownership and best quality.
"We are much honored to receive such prestigious award for the third time as it firmly attests to the Group's commitment in driving innovation and delivering the highest value and innovative solutions to our customers. This Award is a testament for our talented and committed employees in Hong Kong who have worked passionately and relentlessly to pursue innovation." said Mr. Lee Wai Kwong, CEO of ASMPT.
Mr. Lee continued, "We also strongly believe in creating opportunities to nurture and groom young engineering talents in Hong Kong and other societies where ASMPT operates. With this in mind, we have been collaborating closely with local universities and technical institutes in the region through internship programs and scholarship opportunities, and also launched the ASM Technology Award in Hong Kong three years ago to recognize and reward students with outstanding Final Year Projects which demonstrate excellence in technology and innovation. Moving forward, ASMPT will continuously strengthen its research and innovation arena so as to harness technology and to provide the best innovative products with differentiated values to our customers"
About ASM Pacific Technology
ASMPT, founded in 1975, is the only company in the world that can offer high-quality equipment for all major steps in the electronics manufacturing process - from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
ASMPT's Back-end Equipment Business offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, photonics, and optoelectronics industries. Its Materials Business provides customers with a variety of leadframes such as etched and stamping as well as advanced packaging materials. ASMPT' SMT Solutions develops and sells best-in-class DEK printers for the SMT, semiconductor and solar markets as well as best-in-class SIPLACE SMT placement solutions.
ASMPT is listed in the Hong Kong Stock Exchange since 1989.
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