LAS VEGAS, Jan. 9, 2018 /PRNewswire/ -- eYs3D Microelectronics and Etron Technology (TPEx: 5351) announce today that the companies have jointly launched a 3-Dimensional Multi-Aperture Measurement+Eye+Capture Sub-System (3D MAMEC Sub-System) - EX8038 to meet with the needs in depth sensing and machine vision applications, such as unmanned vehicles, robots, AI deep learning, etc.
Utilizing the proprietary 3D Natural-Light AI-Vision IC/ Platform Technologies, EX8038 features a wide range of distant detection from twenty centimeters to five meters with field view angle up to 81 degrees. It is able to detect z-direction deviation from the center with an error margin that is less than 2%. Even under the low light or full darkness conditions, the 3D MAMEC System - EX8038 is able to provide advanced 3D vision that increases target depth accuracy and converts to 3D point clouds quickly.
Traditionally, shorter distance sensing platforms often encounter high z-direction deviation issues at farther distances, while long distance sensing platforms suffer from blind spot issues at shorter distances. "eYs3D and Etron utilized their 3D depth map technologies and developed the 3D MAMEC Sub-System to detect near, middle and far distances with high accuracy," said Jason Lin, Vice President, eYs3D Microelectronics, Co.
Machine vision, depth learning algorithms, sensors, and other technologies have been used to manage stores, whether it is calculating visitor flow (People Counting) or detecting object movement (Thing Counting). The clarity and depth of the information as well as accurate object size and surrounding distance measurement are vitally important. The 3D MAMEC Sub-System can accurately calculate two-way customer flows, detect individual products, and more.
In addition to the 3D MAMEC Sub-System, eYs3D and Etron also provide 3D real-time dual-lens depth-map camera module and ICs. VR / AR is a rapidly emerging market, with many international Smartphone manufacturers equipped to provide consumers with an immersive AR experiences. The technology enables electronic products to obtain the scene's depth and surrounding environment similar to what the human eye can do. For VR / AR applications, it is critical to obtain the subject's 3D (x-y-z) data, in order to compensate the subject's movement errors. Easy-to-use wireless remote control solutions are now being widely used for VR / AR, however they are still not matching with common human gestures, such as grabbing, propelling or even everyday household events like cooking or cleaning. It is better equipped as a solution to control wireless gestures and body motions.
During the CES 2018 tradeshow, both eYs3D & Etron will demonstrate the 3D MAMEC Sub-System, 3D real-time depth-map camera module and ICs, as well as the complete solutions for VR / AR, drone, and people counting applications. Please visit Etron's booth at No. 21639, South Hall 1, Las Vegas Convention Center during CES 2018 from January 9th-12th.
Details of eYs3D and Etron's "Multi-Aperture Measurement+Eye+Capture System" is available at the company's Youtube channel https://youtu.be/T-e9cf9xHy8. For further information, please visit www.eys3d.com or www.etron.com.
About eYs3D Microelectronics, Co.
eYs3D Microelectronics, Co. is a world-leading company in 3D image capture designs and solutions.
About Etron Technology, Inc
Etron Technology, Inc. (TPEx: 5351) is a world-class fabless IC design and product company specializing in application-driven memories, smart ICs and 3D heterogeneous Integration designs of multiple dices primarily adding values for product differentiation of system customers, which include CE- & IOT-DRAMs, Know-Good-Die Memories, High-Speed USB Type-C Controller Chipsets, Novel 3D Natural-Light Depth-Map Vision Sensing ICs and Platforms and the smallest and lightest Spherical 360-degree video capturing chips and subsystems.
For further information, please visit www.etron.com
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