HSINCHU, Taiwan, Sept. 12, 2017 /PRNewswire/ -- SEMICON Taiwan, the premier tradeshow and event for the electronics manufacturing supply chain, opens tomorrow (September 13-15) at Taipei Nangang Exhibition Center, Hall 1. SEMICON Taiwan aims to increasingly connect the entire manufacturing ecosystem vertically and horizontally. In addition, it will provide an overview of market trends and leading technologies in the industry, with forums and business matching activities, which will enable collaboration and new opportunities. Upbeat about the growth prospects of Taiwan's semiconductor sector; SEMICON Taiwan 2017 features 700 exhibitors covering over 1,800 booths, and is expected to attract more than 45,000 visitors in three days.
Taiwan is forecast to spend US$12.3 billion in 2017, making it the second largest fab equipment-spending region, according to the SEMI World Fab Forecast report just issued. Taiwan is a large consumer of semiconductor equipment due to its large foundry and advanced packaging capacity. In addition, Taiwan is the world's largest consumer of semiconductor materials ($9.8 billion in 2016) for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.
Covering the hottest topics like smart manufacturing & automation, high-tech facility, materials, laser, and emerging semiconductor technology, more than 70 presentations will be given on TechXPOT stages, providing the latest technology updates plus opportunities to meet potential partners and customers. To further connect attendees and exhibitors, SEMICON Taiwan facilitates a series of networking events, like the Materials, High-Tech Facility, Laser, and Smart Manufacturing Get Together and the Supplier Search Program, creating business opportunities.
This year SEMICON Taiwan has added new theme pavilions including Circular Economy, Compound Semiconductor, Laser and Opto Semiconductor. In addition, 12 theme pavilions and 8 country/region pavilions are featured.
This is the first year that the International Test Conference (ITC) will be co-located with SEMICON Taiwan 2017, also marking the first time that ITC is held in Asia. The conference will focus on the rapid growth of emerging applications like IoT and automotive electronics, and how testing technologies are challenged by rapid advancements of manufacturing processes, 3D stacking and SiP.
Also co-located with SEMICON Taiwan 2017, the SiP Global Summit will discuss three key system-in-package topics:
- Package Innovation in Automotive
- 3D IC, 3D interconnection for AI and High-end Computing
- Innovative Embedded Substrate and Fan-Out Technology to Enable 3D-SiP Devices
The Jing Jing Lucky Draw is always an anticipated show activity with excellent prizes like Dyson 3-in-1 smart fan, iPad Pro, and Nintendo Switch.
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
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Phone: 886.3.560.1777 ext. 205