New $150 million R&D joint lab in Singapore announced

SINGAPORE - Applied Materials, Inc. has announced plans to establish a new R&D laboratory in Singapore. In collaboration with the Agency for Science, Technology and Research (A*STAR), the S$150 million joint investment will focus on developing advanced semiconductor technology to fabricate future generations of logic and memory chips.

Housed within A*STAR's new R&D cluster at Fusionopolis Two, the lab will have state-of-the-art semiconductor process equipment that has been custom designed and built by Applied Materials. The facility will be staffed by 60 highly skilled researchers and scientists, working together with extended research teams at A*STAR's other research institutes.

The joint lab, also supported by The Singapore Economic Development Board, combines Applied Materials' leading expertise in materials engineering with A*STAR's multi-disciplinary R&D capabilities, and is in line with its efforts to promote leading-edge R&D and advanced manufacturing activities.

Applied Materials plans to conduct experiments on the synchrotron at the Singapore Synchrotron Light Source (SSLS) and work with the National University of Singapore where a new beamline for semiconductor applications is to be developed. Funding for the construction of the new beamline is supported by the National Research Foundation.

Mr Lim Chuan Poh, chairman of A*STAR, said, "This collaboration will catalyse the development of emerging technologies for the global electronics market and advance Singapore's position as a key R&D hub for the industry. The joint lab reaffirms A*STAR's multi-disciplinary R&D capabilities to drive innovation in the electronics sector, a key growth area for Singapore's economy, and will generate further economic value through the creation of good jobs."

The new joint lab marks Applied Materials' second collaboration with A*STAR. In 2012, Applied and A*STAR's IME formed a Center of Excellence in Advanced Packaging in Singapore to develop advanced 3D chip packaging technology.